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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;
| Media | Böcker Pocketbok (Bok med mjukt omslag och limmad rygg) |
| Releasedatum | 28 mars 2019 |
| ISBN13 | 9783319792552 |
| Utgivare | Springer International Publishing AG |
| Antal sidor | 408 |
| Mått | 155 × 233 × 22 mm · 644 g |
| Språk | Tyska |
| Redaktör | Kada, Morihiro |
| Redaktör | Kondo, Kazuo |
| Redaktör | Takahashi, Kenji |