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System on Package Ed edition
Rao Tummala
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System on Package Ed edition
Rao Tummala
"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.
785 pages, Illustrations
| Media | Böcker Inbunden Bok (Inbunden bok med hårda pärmar och skyddsomslag) |
| Releasedatum | 1 april 2007 |
| Ursprungligen utgiven | 2008 |
| ISBN13 | 9780071459068 |
| Utgivare | McGraw-Hill Education - Europe |
| Antal sidor | 785 |
| Mått | 193 × 241 × 35 mm · 1,40 kg |
