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![Cover for Tong, Xingcun Colin, Ph.D. · Functional Metamaterials and Metadevices - Springer Series in Materials Science (Pocketbok) [Softcover reprint of the original 1st ed. 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/621/9783319881621.jpg?tong-xingcun-colin-ph-d-2018-functional-metamaterials-and-metadevices-springer-series-in-materials-science-pocketbok&class=scaled&v=1608717593)
![Cover for Tong, Xingcun Colin, Ph.D. · Functional Metamaterials and Metadevices - Springer Series in Materials Science (Inbunden Bok) [1st ed. 2018 edition] (2017)](https://imusic.b-cdn.net/images/item/original/431/9783319660431.jpg?tong-xingcun-colin-ph-d-2017-functional-metamaterials-and-metadevices-springer-series-in-materials-science-inbunden-bok&class=scaled&v=1619643356)
![Cover for Tong, Xingcun Colin, Ph.D. · Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics (Pocketbok) [2011 edition] (2013)](https://imusic.b-cdn.net/images/item/original/926/9781461427926.jpg?tong-xingcun-colin-ph-d-2013-advanced-materials-for-thermal-management-of-electronic-packaging-springer-series-in-advanced-microelectronics-pocketbok&class=scaled&v=1611604045)
![Cover for Tong, Xingcun Colin, Ph.D. · Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics (Inbunden Bok) [2011 edition] (2011)](https://imusic.b-cdn.net/images/item/original/588/9781441977588.jpg?tong-xingcun-colin-ph-d-2011-advanced-materials-for-thermal-management-of-electronic-packaging-springer-series-in-advanced-microelectronics-inbunden-bok&class=scaled&v=1406142930)