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![Cover for Gan, Chong Leong, · Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering (Pocketbok) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/109/9783031267109.jpg?gan-chong-leong-2024-interconnect-reliability-in-advanced-memory-device-packaging-springer-series-in-reliability-engineering-pocketbok&class=scaled&v=1749647108)
![Cover for Gan, Chong Leong, · Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering (Inbunden Bok) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/079/9783031267079.jpg?gan-chong-leong-2023-interconnect-reliability-in-advanced-memory-device-packaging-springer-series-in-reliability-engineering-inbunden-bok&class=scaled&v=1719008324)