Tipsa dina vänner om produkten:
Manufacturing Challenges in Electronic Packaging Softcover reprint of the original 1st ed. 1998 edition
Y C Lee
Pris
SEK 1.349
Beställningsvara
Förväntad leverans 27 jun - 9 jul
Lägg till din iMusic-önskelista
Manufacturing Challenges in Electronic Packaging Softcover reprint of the original 1st ed. 1998 edition
Y C Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Media | Böcker Pocketbok (Bok med mjukt omslag och limmad rygg) |
| Releasedatum | 25 september 2012 |
| ISBN13 | 9781461376590 |
| Utgivare | Springer-Verlag New York Inc. |
| Antal sidor | 261 |
| Mått | 155 × 235 × 14 mm · 390 g |
| Redaktör | Chen, W.T. |
| Redaktör | Lee, Y.C. |
Se alt med Y C Lee ( t.ex. Pocketbok och Inbunden Bok )