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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
192 pages, biography
Media | Böcker Pocketbok (Bok med mjukt omslag och limmad rygg) |
Releasedatum | 3 december 2010 |
ISBN13 | 9781441948731 |
Utgivare | Springer-Verlag New York Inc. |
Antal sidor | 192 |
Mått | 156 × 234 × 11 mm · 299 g |
Redaktör | Ernst, L.j. |
Redaktör | Leger, O.de Saint |
Redaktör | Zhang, G.q |
Se alt med G Q Zhang ( t.ex. Pocketbok )