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![Cover for Jennie S. Hwang · Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly (Pocketbok) [Softcover reprint of the original 1st ed. 1989 edition] (2012)](https://imusic.b-cdn.net/images/item/original/520/9789401160520.jpg?jennie-s-hwang-2012-solder-paste-in-electronics-packaging-technology-and-applications-in-surface-mount-hybrid-circuits-and-component-assembly-pocketbok&class=scaled&v=1539981537)