Modeling and Application of Flexible Electronics Packaging - Huang - Böcker - Springer Verlag, Singapore - 9789811336263 - 7 maj 2019
Om omslag och titel inte matchar är det titeln som gäller

Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition

Huang

Julklappar kan bytas fram till 31:e januari
Lägg till din iMusic-önskelista

Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.


287 pages, XVII, 287 p.

Media Böcker     Bok
Releasedatum 7 maj 2019
ISBN13 9789811336263
Utgivare Springer Verlag, Singapore
Antal sidor 287
Mått 629 g

Visa alla

Fler produkter med Huang

Se alt med Huang ( t.ex. Bok , Inbunden Bok , Pocketbok och CD )