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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly Jennie Hwang New edition
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Jennie Hwang
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
456 pages, 77 black & white illustrations, biography
| Media | Böcker Pocketbok (Bok med mjukt omslag och limmad rygg) |
| Releasedatum | 24 september 1992 |
| ISBN13 | 9780442013530 |
| Utgivare | Van Nostrand Reinhold Inc.,U.S. |
| Antal sidor | 456 |
| Mått | 152 × 229 × 24 mm · 639 g |
| Språk | Engelska |
Fler produkter med Jennie Hwang
Visa alla![Cover for Jennie Hwang · Implementing Lead-Free Electronics (Inbunden Bok) [Ed edition] (2005)](https://imusic.b-cdn.net/images/item/original/746/9780071443746.jpg?jennie-hwang-2005-implementing-lead-free-electronics-inbunden-bok&class=scaled&v=1395779073)
Se alt med Jennie Hwang ( t.ex. Inbunden Bok och Pocketbok )